清华大学微电子封装技术 封装基板技术简介

封装基板技术简介蔡坚清华大学微电子学研究所Tel:010-62781852,Fax:010-62771130jamescai@tsinghua.InstituteofMicroelectronics¾封装类型与发展¾BGA的分类与基本结构¾BGA基板的发展与简介¾BGA封装的发展InstituteofMicroelectronics封装的类型与发展InstituteofMicroelectronics封装类型InstituteofMicroelectronics通孔接插(PTH)与表面贴装(SMT)InstituteofMicroelectronics封装发展的变迁TheFirstTheSecondEvolutionEvolutionTHT-->SMT-->SMT?(Peripheral)(GridArray)FC-BGASysteminpackageMCM-BGAQFPDensityPBGAWLCSPFC-CSPCSPHighTSOPWhat'sNew?●3DPackaging??PDIP●OR??ICLSIVLSI1970199020002010InstituteofMicroelectronics各类封装的份额(台湾)PDIPTSOP2%4%4%PBGA38%QFP24%SOPTQFP4%TFBGA21%3%InstituteofMicroelectronicsBGA的分类与基本结构InstituteofMicroelectronicsBGA的基本分类InstituteofMicroelectronicsPBGA基本结构(Substrate)InstituteofMicroelectronics