清华大学微电子封装技术 新型封装技术(2)

P基本结构•FCOB-CSP的基本结构InstituteofMicroelectronics51InstituteofMicroelectronics52CSP的典型应用CSP的其他应用BasicPerformanceBasicLogicPerformanceMemoriesMemoriesChipsCPUs<50I/O50-100I/O100-200I/O500+I/O<100MHzto1GHz100-200MHzto1GHz<1W1-3W1-3W20-100We.g.,Flashe.g.,RDRAMe.g.,micro-controllers,e.g.,high-perfCPUsIntelFlashMemoriesinCSPwith40I/OsomeDSPInstituteofMicroelectronics53InstituteofMicroelectronics549Tessera的MicroBGA几种芯片尺寸封装简介•FromTessera,usedforFlashMemoryandDRAMInstituteofMicroelectronics55InstituteofMicroelectronics56MitsubishiCSP的再布线LOC-CSP流程外接凸块引线框架环氧树脂聚酰亚胺层内接凸块引线键合粘接剂芯片芯片铅锡焊料钝化层芯片压焊块再布线•FromHitachiCable,usingforDRAMInstituteofMicroelectronics57InstituteofMicroelectronics58LOC-CSP流程(续)Fujitsu公司的MicroBGA腐蚀引模塑镀Ni引线框架线框架树脂切筋、成叠加型、测试树脂树脂上打洞InstituteofMicroelectronics59InstituteofMicroelectronics6010