半导体封装制程及其设备介绍

-size24~32DualpitchintheIn-linewidthPackagedirectionPBGAPinGrid254mm(100miles)Sandisk封裝型式SurfaceShapeTypicalFeaturesMountMaterialLeadPitchNoofl/O1.27mmOutlinePlastic2directionQFP1.0,0.8,0.65mmQuad-FlatPlastic4direction88~200PackSandisk封裝型式SurfaceShapeTypicalFeatMountMaterialLeadPitchNoofl/O127,0.762FlatPackageaCeramic/(50,30miles)2.4direction20~1.27,1.016,Leadless0762mm20~40ChipCeram(0,40,30Sandisk1封裝型式SurfaceShapeTypicalFeaturesMountMaterialLeadPitchNoofl/eramicj-shapebend18-124Leaded4directionChipCarrierVSQFCeramicSmall0.532~200QuadSandiskAssemblyMainProcessSMT(Optional)TapingGrindingDetapingUVCure(Optional)(Optional)(Optional)Mount(Optional)DiecureDiesawDieBondPlasma(Optional)WireBondMoldinglostMoldCureLasermarkLasercutPackageSawCleanerMemoryTestCardAsyCardTestPackingforOutgoingSandisk1