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MEMS器件低应力封装技术

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ence. IEEE, 2014: 1-5. MEMS devices from package stresses by use of compli-Р[22] Henkel. Materials for micro- electro- mechanical systems ant metal interposers[C]// 56th Electronic ComponentsР (MEMS) [EB/OL]. [2020- 11- 5]. https://dm.henkel- dam. and Technology Conference. IEEE, 2006: 1108-1117.Р com/is/content/henkel/lt- 6742- brochure- micro- electro- [28] SCHRÖDER S, NIKLAUS F, NAFARI A, et al. Stress-Р mechanical-systems-print-a4. minimized packaging of inertial sensors by double-sidedР[23] 孙志国 . MEMS 封装中的残余应力演化及其相关可 bond wire attachment[J]. Journal of Microelectromechan-Р 靠性研究[D]. 上海:中国科学院研究生院微系统与 ical Systems, 2015, 24(4): 781-789.

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