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18179.NOKIA手机-SMT工艺文件

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officially accepted by printer Р manufacturer. Use of isopropanol (IPA) or Р equivalent solvents is not mended due Р to fire safety. Р mended cleaning fluid for Multicore Prozone SC-02 is preferred (SC-02 Р cleaning of misprinted boards will attack slightly acrylics and some rubbers Р used in protective gloves) Р Use of isopropanol (IPA) is allowed but not Р mended. Waste must be handled Р properly. Р Note! Components that are not designed for Р liquid cleaning process, have to be removed Р and changed after cleaning. Р PWB with laser (micro) vias, OSP plating or Р which are totally or partly Aramid based, ARE Р NOT ALLOWED TO BE WASHED! Cleaning Р solvent traps into PWB structures and reduces Р esp. ponents joint reliability. РNMP SMD Process Specification Copyright © Nokia Mobile Phones

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