Specimen M, surface mounting solderability testing, mm................................. 91 Figure 12-17 Test Specimen N, surface mounting bond strength and peel strength, mm..................... 92 Figure 12-18 Test Specimen S, mm.................................... 92 Figure 12-19 Systematic path for implementation of statistical process control (SPC) .................... 93 Tables Table 3-1 PWB Design/Performance Tradeoff Checklist Considerations.................................. 5 Table 3-ponent Grid Areas................................... 14 Table 4-1 Typical Properties mon Dielectric Materials ......................................................... 16 Table 4-2 Environmental Properties mon Dielectric Materials ......................................... 17 IPC-2221 February 1998 viii
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