-Lushaowu-Signal Layer Opt(11)命令Analysis – Signal layer Checks(13)注意预大,有没有多PAD少PAD、变形等(16)重要步骤。10崇高理想必定到达内部资料,敬请保密附图:外层制作常用参数外层补偿值干膜封孔能力0.40/0.500.13/0.150.18/0.200.356OZ0.40/0.500.13/0.150.18/0.200.305OZ0.35/0.400.13/0.150.15/0.180.244OZ0.30/0.350.13/0.150.15/0.180.203OZ0.18/0.250.2/0.250.13/0.150.12/0.120.202.5OZ0.15/0.200.18/0.250.13/0.150.10/0.120.162OZ0.10/0.150.13/0.130.10/0.150.08/0.100.121.5OZ0.10/0.150.13/0.180.10/0.150.08/0.100.081OZ0.10/0.150.13/0.180.10/0.150.08/0.100.040.5OZ0.10/0.150.13/0.180.10/0.150.08/0.100.021/3OZ电金板非电金板预大后最小/一般RING mm预大后PAD与线最小/一般间隙mm预大后线与线最小/一般间隙mm蚀刻量(预大值)mm底铜干膜封孔菲林一般要比钻孔孔径大单边0.20MM,最小0.15MM,当钻孔径>6.0mm时,干膜封孔菲林比钻孔孔径单边大至少0.2mm。备注7.0*9.5mm6.5*9.0mm5.5*8.0mm槽孔封孔能力9.0mm8.0mm7.0mm孖孔封孔能力(相交后的孔长度)9.0mm7.5mm6.0mm独立孔封孔能力当板厚>1.2mm时1.0mm<板厚≤1.2mm时当板厚≤1.0mm时板厚干膜封孔能力
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