ng is prop osed. In the reduced area, the material is removed equally by automatic regulating dies rotating speed. Furthermore, the laser pulse ene rgy is controlled to decrease with the reduction of the aperture, which correspondingly improve s the pass precision. The experimental result shows that the proposed model can improve the machining precision of the dies efficiently. The aperture of 3.5 μ m can be obtained. It is proved that the model proposed in this paper is essful and effective for micro-nano fabrication of integrated circuit le ad dies. Key words :Laser micro-nano fabrication Precise integrated circuit lead dies New model 资助项目: 国家自然科学基金资助项目(50575025) 。作者简介:曹凤国, 1945 年出生,研究员,博士生导师,主要研究方向为精密特种加工技术,已出版专著 4部,发表学术论文 70 余篇。联系人:张勤俭,电话: 010-58717687 E-mail :fgucao@
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