from a nominal characteristic. 1.6 Land Pattern Determination This document dis- cusses two methods of providing information on land pat- terns: (1) exact details based on ponent speci?ca- tions, board manufacturing ponent placement accuracy capabilities. These land patterns are regis- tered to a ponent, and have a registered land pattern number, see Table 3.5 and paragraph 3.3.3.4. (2) equations that can be used to alter the given informa- tion to achieve a more robust solder connection, when used in particular situations where the equipment for placement or attachment are more or less precise than the assumptions made when determining the exact land pattern details. 1.6.1 General Usage of SMT In general, a product is a good candidate for SMT if it needs to be: IPC-SM-782A December 1999 2
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