经典plasma原理

lderReflowBetterBondBetweenDieandSubstrateBetterHeatDissipationMinimizesDelamination去除:导线连接?ContaminationRemoval:WireBondingPoorWireBondStrengthContaminationOxidationSmallerBondPadPitches80mmto25mmHigherRatioofContaminationtoPadandWireDeformationWeldingInhibitedByPhysicalProcess:ContaminantsActAsPhysicalBarrierChemicalProcess:ContaminantsFormBondsWithSurfacesandMinimizeAdhesionEpoxyResinBleedout去除:导线连接?ContaminationRemoval:WireBondingPlasmaProcessingRemovesTraceContaminationandOxidationFromSubstratesMetalCeramicPlasticWireBondStrengthSignificantlyIncreasedThroughputIncreased:LowerPressureRequired去除和表面活化:封装?ContaminationRemovalandSurfaceActivation:poundsSubstrateMaterialSolderMaskDieMetalBondPadsSeveralMaterialsBondingtoOneAnotherDelaminationCanResultFromPoorSurfaceActivityandContamination*