rature (deg.C) Viscosity (Pa.s) mend die attach condition Viscosity of Die bond paste NEX-130CX NEX-130CX Polyimide Polyimide Copper Copper 2 2 nd nd Die Die 1st Die 1st Die NEX-130CX NEX-130CX BT BT For Die to Sub For Die to Die (COW structure) DAF Improvements (3) DAF Improvements (3) ? Improved wire bond stability – Remains high elastic modulus after curing at WB temperature 1.E+05 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 0 50 100 150 200 250 300 Temperature ( degC ) Elastic modulus (Pa) * After curing : 180degC / 1hour Wire-bonding temperature Conventional Die moving at Wire bond Stable Leadframe Fine pitch of wire bonding space Au wire Rolling up Bleeding Inclination Problems in current processing for Stacked CSP Problems of Current DAF Problems of Current DAF Lintec Tape Nitto Tape
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