0s 95℃×30sР Curing Schedule 130℃×35s 120℃×20s 120℃×20sР 銅板腐食性 90%RH,Р Copper Plate 60℃, サビ、変色なしР Corrosion 500h No rust or discolorationР 初期Р Original >100 NР 接着性 260℃ﾊﾝﾀﾞ浴Р 硬化後特性Adhesiveness 10s×2ﾊﾟｽ後Р After Soldering >100 NР SOP 10s/260℃,2passР 1 mg×2 spot Р 260℃ﾊﾝﾀﾞ浴中Р at 260 ℃ 15 N 10 N 10 NР in solder bathР 体積抵抗率Р Vol. resistance 25 ℃[Ω･cm] 2.9×1015 1. 3×1014 1.3×1014Р ratioР 比誘電率/誘電正接Р Permittivity / Р Dielectric 1 MHz,25℃ 4.0 / 0.021 4.23 / 0.055 4.23 / 0.055Р Loss Tangent Р 煮沸吸水率 2hР Water boiling 0.3 1.1 1.1Р Absorption [% ]Р Features aftercuring 23℃Р 2.0[mm/min] 10.5 MPa 12.6 MPa 12.6 MPaР 引張せん断強度Р Tensile Strength 250℃Р 2.0[mm/min] 1.44 MPa 1.81 MPa 1.81 MPaР 熱膨張係数Р Rate of TMA[/℃] 6.1×10-5 5.86×10-5 5.86×10-5Р Line ExpansionР ガラス転移温度Р Glass transition TMA[℃] 120 30 30Р Temp.Р 7
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