ipc-a-600h-2010印制板的可接受性中文版

ion Material Fill, Laminated TypeР(层压型板绝缘材料填充中的裂缝)....................... 158Р4.2.6 Core Bond to Plated-Through Hole WallР(金属芯与镀覆孔壁的连接)................................... 159Р4.3 Flush Printed Boards(齐平印制板) ................................. 160Р4.3.1 Flushness of Surface ConductorР(表面导体的平整性)............................................... 160Р5 Cleanliness(清洁度测试) ................................................... 161Р5.1 Solderability(可焊性测试) ................................................. 162Р5.1.1 Plated-Through Holes (Applicable to Test C/C1)Р(镀覆孔(适用于C/C1 测试)) ............................... 163Р5.2 Electrical Integrity(电⽓完整性) ....................................... 164Р完整资料:Рhttps://item./item.htm?id=542957151315Р其它IPC标准(IPC-A-610,IPC-A-600, IPC-A-620等)请联系:РQQ:1395833280РMail: cdm_lj@