riptionРλbРDual-In-Line PackageР0.00064РSingle-In-Line PackageР0.00064РChip carrierР0.00064РPin grid arrayР0.00064РTransistorР0.0051Р……Р……Р πP: Active Pins FactorР πP = exp((N-1)/10)0.39Р N= Number of active PinsР πQ: 选用“Lower”: 1.0Р πE: GB: 1.0; GF: 3.0; GM: 14.0Р5.2.9 PCBР5.2.9.1计算公式:λP=λb×[N1×πC+N2×(πC+13)] ×πQ×πEР5.2.9.2参数说明:Р λb: Base failure rateР TechnologyРλbРPrinted wiring assembly/ Printed circuit boards with PTHsР0.000017РDiscrete wiring with electrolessРDeposited PTH(≤2 Levels of Circuitry)Р0.00011Р PTH: Plated through- holeР N1 &N2: Number of PTHs FactorРFactorРQuantityРN1РAutomated techniques: quantity of wave infrared(IR) or vapor phase soldered functional PTHsРN2РQuantity of hand soldered PTHsР πC: Complexity FactorР πC = 0.65 × P0.63 Р P: Number of circuit planes (2 to 18)
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