h or dip in running water, after which the specified measurements shall be performed.РConcentration : 5±1%РSpray time : 48±4 hoursРAmbient temperature: 35±2℃Р目视外观无任何损坏异状РNo DamageР接触阻抗60mΩ以下РContact Resistance 60mΩ MAXР焊锡性РSolderabilityР锡温245±5℃,将导电端子浸入锡炉面至HousingР距离锡面1.0mm位置,焊锡时间3±0.5秒.РTip of solder tails and fitting nails into the moltenРSolder (held at 245±5℃) up to 1.0mm from theРbottom of the housing for 3±0.5 seconds.Р润湿面积75%以上,并不得有漏焊针孔现象.Р75% of immersed Рarea must show Рno voids ,pin holes.Р焊锡耐热性РResistance to РSoldering HeatР使用红外线回流焊请参考第7点РWhen reflowing refer to paragraph 7.Р目视外观无任何损坏异状РNo DamageР使用烙铁手焊时须可符合下述焊锡条件РSoldering iron methodР0.2mm from terminal tip and fitting nail tip.РSoldering time : 5 seconds maxРSolder temperature : 310℃ maxР7.红外线回流焊温度曲线 INFRARED REFLOW CONDITION
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