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填充石墨烯导热胶粘剂的导热特性研究

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oong-sun, Yu Jin. Comparative study of thermally conductive fillers in under fill for the ponents [J]. Journal of Diamond and Related Materials, 2005, 14(10): 1647-1653 Р储九荣, 张晓辉, 徐传骧. 导热高分子材料的研究与应用.高分子材料科学与工程, 2000, 16(4): 17-22РAlexander A.Balandin,Suchismita Ghosh, Bao Wen-zhong,et al. Superior thermal conductivity of single-layer grapheme [J]. Nano Letters, 2008, 8(3): 902-907РGustafsson S E. Transient plane source technique for thermal conductivity and thermal diffusivity measurements of solid materials [J]. Rev Sci Instrum, 1991, 62(3): 797-804Р王强, 戴景民, 何小瓦. 基于Hot Disk方法测量热导率的影响因素.天津大学学报. 2009, 42(11): 970-974РYu Ai-cing, Palanisamy Ramesh, Robert-C. Haddon, et al. Graphite-Nano platelet posite Thermal Interface Materials [J]. Journal of Physical Chemistry Letters, 2007, 111, 756–759

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